Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/1621
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ivanyshyn, Iryna | - |
dc.contributor.author | Freik, D. | - |
dc.contributor.author | Galushchak, M. | - |
dc.contributor.author | Shperun, Volodymyr | - |
dc.contributor.author | Zapukhlyak, Ruslan | - |
dc.contributor.author | Pyts, Myhailo | - |
dc.date.accessioned | 2020-03-21T16:28:44Z | - |
dc.date.available | 2020-03-21T16:28:44Z | - |
dc.date.issued | 2000 | - |
dc.identifier.citation | Freik D.M., Galushchak M.O., Ivanyshyn I.M., Shperun V.M., Zapukhlyak R.I., Pyts M.V. Thermoelectric properties of solid solutions based on the Telluride of Tin // Semiconductor Physics. Quantum Electronics and Optoelectronics. 2000. V.3, №3. P. 287–290. | uk_UA |
dc.identifier.other | https://doi.org/10.15407/spqeo3.03 | - |
dc.identifier.uri | http://hdl.handle.net/123456789/1621 | - |
dc.description.abstract | The relation of a thermoelectric parameters of the solid solutions based on tin telluride: SnTe-MnTe, SnTe-Cu2Te and SnTe-In2Te3: Pb versus an amount of dopant impurity are investigated. The crystaloquasichemical mechanism of the solid solutions formation are proposed. Showed is that at the expense of essential decreasing of a thermal conductivity factor in the solid solutions the improvement of the basic thermoelectric parameters of the material takes place. The compositions which have a maximum values of the thermoelectric Q-factor are retrieved. | uk_UA |
dc.language.iso | en | uk_UA |
dc.publisher | V. Lashkaryov Institute of Semiconductor Physics of National Academy of Sciences of Ukraine | uk_UA |
dc.subject | tin telluride, solid solutions, thermoelectric parameters, crystaloquasichemical mechanism | uk_UA |
dc.title | Thermoelectric properties of solid solutions based on the Telluride of Tin | uk_UA |
dc.type | Article | uk_UA |
Appears in Collections: | Статті та тези (ФФВС) |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.